Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -

신규 논문 알림서비스 신청
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -

Publisher : The Institute of Electronics and Information Engineers

Journal Type : Proceeding

Frequency : annual

Classification

- Subscription Classification : Engineering

- Basic Classification : Engineering > Electronics/Communications Engineering

- KDC : 기술과학 > 전기공학, 전자공학 > 전자공학

- KCI Classification : 공학 > 전자/정보통신공학

KORMARC View

URL : http://www.dbpia.co.kr/Publication/PLCT00000558 Copy  Add Bookmark

more
수록정보 및 DBpia 이용/인용 지표
Publication Info Date range 1989~1991 Vol/Iss 2 Articls 29
DBpia Usage/Citation Usage 1,027 Citations 0 2017/2018 Usage Factor 0

DBpia Insight is available to Institutional member or author member of DBpia.

Concerns about more information on DBpia usage/citation? Click here. >

Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -, 1991.1
top