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이 논문의 연구 히스토리 (4)
2022
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초록· 키워드
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Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.
목차
Abstract
1. 서론
2. 실험방법
3. 결과 및 고찰
4. 결론
References
참고문헌 (34)
참고문헌 신청
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Y. Yoneda, K. Nakamura, Packaging technology for imaging LSI, Fujitsu, 63 (2012) 489-495.
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W. Chu, M. L. Schattenburg, H. I. Smith, Low-stress gold electroplating for x-ray masks, Microelectron. Eng., 17 (1992) 223-226.
T. Osaka, Y. Okinakab, J. Sasano, M. Katod, Development of new electrolytic and electroless gold plating processes for electronics applications, Sci. Technol. Adv. Mater., 7 (2006) 425–437.
Y. Yoneda, K. Nakamura, Packaging technology for imaging LSI, Fujitsu, 63 (2012) 489-495.
Y. Ejiri, T. Sakurai, Y. Arayama, K. Suzuki, Y. Tsbomatsu, S. Hatakeyama, S. Arike, Y. Hiroyama, K. Hasegawa, Electroless Ni/Pd/Au plating for semiconductor package substrates (I) - Influence of the electroless Ni plating thickness on the solder ball joint reliability, J. Japan Inst. Electron. Packag., 15 (2012) 82-95.
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