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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
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In this study, copper foil was electroplated under high current density conditions. We used Polyethylene Glycol (PEG), known for its thermal stability and low decomposition rate, as an inhibitor to form a stable and smooth copper layer on the titanium cathode. The electrolyte was composed of 50 g/L CuSO₄ and 100 g/L H₂SO₄, MPSA as an accelerator, JGB as a leveler, and PEG as a suppressor, and HCl was added as chloride ions for improving plating efficiency. The copper foil electroplated in the electrolyte added PEG which induced to inhibit the growth of rough crystals. As a result, the surface roughness value was reduced, and a uniform surface was formed over a large area. Moreover, the addition of PEG led to priority growth to the (111) plane and the formation of polygonal crystals through horizontal and vertical growth of crystals onto the cathode. In addition, the grains became fine when more than 30 ppm of PEG was added. As the microcrystalline structure changed, mechanical and electrical properties were altered. With the addition of PEG, the tensile strength increased due to grain refinement, and the elongation was improved due to the uniform surface. However, as the amount of PEG added increased, the corrosion rate and resistivity increased due to grain refinement. Finally, it was possible to manufacture a copper foil with excellent electrical and mechanical properties and the best surface properties when electroplating was carried out under the condition of additives with Cl-20 ppm, MPSA 10 ppm, JGB 5 ppm, and PEG 10 ppm.
목차
Abstract
1. 서론
2. 실험 방법
3. 결과 및 고찰
4. 결론
REFERENCES
참고문헌 (30)
참고문헌 신청
M. Yokoi, S. Konishi, T. Hayashi, Adsorption behavior of polyoxyethyleneglycole on the copper surface in an acid copper-sulfate bath, Denki Kagaku, 52 (1984) 218-223.
T.G. Woo, I.S. Park, Changes in electrical properties of copper-plated layer by organic additives on high current density, Korean Journal of Metals and Materials, 58 (2020) 41-48.
T.G. Woo, J.J. Park, I.S. Park, Initial behavior of additives and mechanical properties of copper foils on high current density, Korean Journal of Metals and Materials, 59 (2021) 304-313.
Y.H. Kim, J.W. Lim, G.Y. Park, O.T. Lim, Electric vehicle market and battery related technology research trends, The Korean Hydrogen and New Energy Society, 30 (2019) 362-368.
T.G. Woo, M.H. Lee, K.W. Seol, Effect of gelatin and chloride ions on the mechanical properties and microstructural evolution of copper foil, Korean Journal of Metals and Materials, 56 (2018) 518-523.
T.G. Woo, I.S. Park, Changes in electrical properties of copper-plated layer by organic additives on high current density, Korean Journal of Metals and Materials, 58 (2020) 41-48.
T.G. Woo, J.J. Park, I.S. Park, Initial behavior of additives and mechanical properties of copper foils on high current density, Korean Journal of Metals and Materials, 59 (2021) 304-313.
Y.H. Kim, J.W. Lim, G.Y. Park, O.T. Lim, Electric vehicle market and battery related technology research trends, The Korean Hydrogen and New Energy Society, 30 (2019) 362-368.
T.G. Woo, M.H. Lee, K.W. Seol, Effect of gelatin and chloride ions on the mechanical properties and microstructural evolution of copper foil, Korean Journal of Metals and Materials, 56 (2018) 518-523.
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