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Cooling of Electronic Systems by Using Manifold Microchannel Heat Sinks
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Cooling of Electronic Systems by Using Manifold Microchannel Heat Sinks
초록·키워드
Analytical and experimental studies of manifold microchannel (MMC) heat sinks were performed. The MMC differs from a traditional microchannel heat sink in that the flow length is greatly reduced to a small fraction of the total length of the heat sink. Alternating inlet and outlet channels guide the coolant to and from the microchannels. At a given coolant flow rate, increasing the number of inlet/outlet channels (a conventional microchannel heat sink has one channel) reduces the convective thermal resistance. The convective thermal resistance is a strong function of channel width and a weak function of channel depth. Heat sinks with channel walls narrower than the channel width showed better performance than those with equal wall thickness and channel width. The capacity thermal resistance, a function of the coolant flow rate only, became dominant at low flow rates. Generally, the measured convective thermal resistance was lower than predicted. The experimental dependence on flow rate was considerably stronger than predicted. This resulted in a slight difference in experiment and analysis at low flow rates, which increased to a significant difference at high flow rates. In comparison to the analytical predictions, the effect of microchannel width was considerably weaker, while those of wall thickness ratio and manifold channel width were about the same. Increasing the channel depth resulted in a higher resistance, opposing the predicted effect.
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UCI(KEPA) : I410-ECN-0101-2009-550-012627796
