인문학
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자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
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커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
피인용 0
초록·키워드
In post exposure bake (PEB) process of semiconductor devices production, a shape of critical dimension (CD) could be changed into an inappropriate form by superfluous heating temperature and time of a hot-plate. This is because redundant diffusion of acid can occur from them. In the past, there was little concern about such deformation of CD because the line width of CD that we wanted was relatively thick. However, now we need to control with prudence heating temperature and time of a hot-plate for a thinner line width (ex. sub-32nm) of CD that is used lately. These reasons let us have a desire to start this work.
Here we present a mathematical heat conduction model during PEB process for getting suitable heating temperature and time and compute it by using numerical method.
Computation of the heat conduction is a very delicate matter, especially because of the multiscale conductivity and thickness of stacked sublayers of the wafer. However, through our method we could markedly reduce the unknowns. Thus, our metho ... 전체 초록 보기
Here we present a mathematical heat conduction model during PEB process for getting suitable heating temperature and time and compute it by using numerical method.
Computation of the heat conduction is a very delicate matter, especially because of the multiscale conductivity and thickness of stacked sublayers of the wafer. However, through our method we could markedly reduce the unknowns. Thus, our metho ... 전체 초록 보기
본문·목차
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
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최근 본 자료 전체보기
UCI(KEPA) : I410-ECN-0101-2012-410-003696998
