인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
개인구독
소속 기관이 없으신 경우, 개인 정기구독을 하시면 저렴하게
논문을 무제한 열람 이용할 수 있어요.
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록·키워드
Solid State Transformer (SST) is an alternative to the conventional distribution transformer for smart grid applications. By employing a compact Medium-Frequency (MF) transformer for isolation, the SST has merits on size and weight. It also provides flexible utilization as a FACTS component. The switching converters are a potential source of Common-Mode (CM) and HF EMI noises. These noises are more nuisance in a SiC device based SST which switches at a high dV/dT at the Medium-Voltage (MV) level resulting in high CM voltages. The SST floating metalic surfaces such as heatsink and the output must be grounded for safety and smooth operation. However there are various significant low impedance paths present, including the parasitics of the compact transformer, which may conduct CM noise to the grid. The generated CM noise may affect the controls. This paper presents the CM and grounding challenges in the multistage integration of a three-phase SST system based on 15kV SiC IGBTs termed as Transformerless Intelligent Power Substation (TIPS). The TIPS interfaces MV 13.8kV and LV 480V grids using MV ac-dc, MV to LV dc-dc dual active bridge and LV dc-ac inverter stages. A study on the CM noise in the TIPS and a passive filter solution for its attenuation is presented in this paper. A time domain simulation considering the passive filter specification is also presented. The experimental results for line to line 3.64kV MV grid integration are presented. A LV prototype is used to verify the complete grounding and the CM choke design at a scaled-down condition.
본문·목차
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.