인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
피인용 0
초록·키워드
The semiconductor cleaning process uses various corrosive and toxic chemicals, so there is a risk of safety accidents. in this study, equipment to be evaluated was selected considering the materials handled, safety devices, and operating conditions of the cleaning facility. and than qualitative risk assessment method HAZOP was applied to determine high-risk accident scenarios. based on the derived scenario, layer of protection analysis (LOPA), a quantitative risk assessment method, was performed to review whether current safety measures were appropriate. afterwards, we attempted to determine whether the risk was acceptable and suggest directions for further improvement. HAZOP results showed a high risk of chemical liquid leakage due to corrosion and damage to wastewater pipes and corrosion of baths and chambers. LOAP results confirmed that the sum of the intermediate accident frequencies 1.23×10<SUP>-6</SUP> was within an acceptable range 1×10<SUP>-4</SUP> ~ 1×10<SUP>-6</SUP>. It was confirmed that the frequency of accidents mitigated could be reduced to 3.31×10<SUP>-7</SUP> by taking additional safety measures such as installing a sealing system in pipes at risk of corrosion.
본문·목차
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