인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
피인용 0
초록·키워드
Purpose: To identify the failure mechanism of mouse-bite defects and test a detection method that uses 4-wire resistance measurements at the location of the defect.
Methods: The failure of circuit boards due to mouse-bite defects was analyzed based on an electronic component failure analysis procedure. The hypothesis was then verified by finite element analysis and a reproducible reliability test. The normalized R, which normalizes the circuit resistance values to detect mouse-bite defects, was calculated and the probability distribution of the circuits was shown. The probability distribution including mouse-bite defects was visualized to distinguish the fault-free circuits from those above the 3-sigma upper limit.
Results: Failure mechanisms for mouse-bite defects can include increased resistance in localized areas of the circuit. This leads to Joule heating at the mouse-bite defects. Because of the mismatch in the coefficient of thermal expansion between the copper and dielectric materials, mechanical stress can be concentrated at these sites, leading to cracking. Mouse-bite defects were defined as those with a circuit width of 4 mm or less, and a circuit thickness of 7 mm or less, based on the failure analysis results. These defects were confirmed to cause open-circuit failures under use conditions. Successful detection of mouse-bite defects was confirmed based on a 3-sigma upper limit of the Normalized R metric.
Conclusion: By defining the failure mechanism of the mouse-bite defects, we confirmed the possibility of detecting these sites using a 3-sigma upper limit based on the Normalized R metric measured with a 4-wire ohmmeter.
Methods: The failure of circuit boards due to mouse-bite defects was analyzed based on an electronic component failure analysis procedure. The hypothesis was then verified by finite element analysis and a reproducible reliability test. The normalized R, which normalizes the circuit resistance values to detect mouse-bite defects, was calculated and the probability distribution of the circuits was shown. The probability distribution including mouse-bite defects was visualized to distinguish the fault-free circuits from those above the 3-sigma upper limit.
Results: Failure mechanisms for mouse-bite defects can include increased resistance in localized areas of the circuit. This leads to Joule heating at the mouse-bite defects. Because of the mismatch in the coefficient of thermal expansion between the copper and dielectric materials, mechanical stress can be concentrated at these sites, leading to cracking. Mouse-bite defects were defined as those with a circuit width of 4 mm or less, and a circuit thickness of 7 mm or less, based on the failure analysis results. These defects were confirmed to cause open-circuit failures under use conditions. Successful detection of mouse-bite defects was confirmed based on a 3-sigma upper limit of the Normalized R metric.
Conclusion: By defining the failure mechanism of the mouse-bite defects, we confirmed the possibility of detecting these sites using a 3-sigma upper limit based on the Normalized R metric measured with a 4-wire ohmmeter.
본문·목차
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
최근 본 자료 전체보기
UCI(KEPA) : I410-151-25-02-091262000
