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초록·키워드
In recent years, electronic devices have advanced towards higher power and integration, largely driven by advancements in AI technology. The thermal stability of semiconductor technology within these devices is critical for maintaining performance, necessitating effective thermal management strategies. High-power devices often employ heat sinks; however, the gaps and air layers between components and heat sinks can significantly hinder heat dissipation. Thermal Interface Material (TIM) mitigates this issue by filling these gaps, thereby reducing contact thermal resistance and enhancing heat dissipation. Despite extensive global research on the thermal conductivity of TIM, there is a notable lack of domestic standards for measuring this property, leading to a reliance on international standards. This study aims to develop thermal conductivity measurement equipment and compare its performance with existing methods. The newly developed device, designed by the ASTM D5470 standard, comprises a copper heater block, a copper meter bar, and a constant temperature water bath, enabling accurate measurement of the thermal conductivity of TIM specimens under controlled conditions. Experiments were conducted with two types of TIM, and the results were compared to those obtained using a DynTIM Tester. The experimental device demonstrated thermal conductivities of 5 W/m⋅K and 5.34 W/m⋅K, with results within 6% of those measured by the DynTIM Tester, verifying the device's reliability. The validated reliability of this experimental setup suggests its potential for future research and broader data collection on the thermal conductivity of TIM.
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