인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록·키워드
The rapid growth of GPU integration for AI workloads in modern data centers has intensified power consumption and thermal management challenges. Although single-phase cooling methods such as jet impingement and microchannel systems have been widely explored, their high pumping power demand limits overall energy efficiency. Two-phase cooling, by exploiting phase change, offers superior heat transfer performance; however, reliable operation requires enhancement of the Critical Heat Flux (CHF). Existing approaches largely rely on boiling-enhanced surfaces involving complex fabrication, whereas tapered gap structures provide a simpler alternative. In this study, a pool-boiling-based cooling plate with tapered gap structures was developed to cool high-power chips with reduced pumping power. Experimental investigations revealed that CHF in non-inclined structures increased with gap height, while tapered structures exhibited an optimal gap height. The configuration with H/W = 1 and a 20° inclination achieved the lowest thermal resistance (0.061 K/W), the highest heat transfer coefficient (20,185 W/m²⋅K), and a junction temperature of 191.1°C. Compared with an unstructured case, CHF improved by up to 78% (105 W/cm²). These results demonstrate that tapered gap structures can be effectively optimized in two-phase cold plate designs, providing enhanced thermal performance and design flexibility for next-generation high-power electronic devices.
본문·목차
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