인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
피인용 0
초록·키워드
This study presents a trace-informed thermo-mechanical analysis framework for predicting Warpage behavior in multilayer Printed Circuit Boards (PCBs) during the reflow process. A seven-layer PCB composed of FR-4, Copper, and Prepreg is modeled. Electronic computer- aided design (ECAD)-derived layer Copper (Layer-Cu) and zone Copper (Zone-Cu) data are incorporated into effective material properties to represent spatial heterogeneity in stiffness and thermal expansion. A transient thermal analysis based on an IPC-compliant reflow temperature profile is sequentially coupled with structural analysis in ANSYS to evaluate temperature evolution, Out-of-plane deformation, and stress distribution. Five representative mechanical support configurations, including Weak springs, Simple support, 3-point support, Carrier support, and Rail support, are examined under different convection conditions. The results show that mechanical support conditions strongly influence both the magnitude and deformation mode of PCB Warpage under identical thermal loading. Carrier support and Rail support configurations more realistically represent reflow process constraints, whereas 3-point support results in localized deformation and relatively conservative Warpage responses. Variations in convection coefficients affect the absolute Warpage magnitude but do not alter the relative Warpage trends among different support conditions. Overall, the proposed framework clarifies the combined effects of Copper distribution asymmetry, transient thermal gradients, and mechanical constraints on PCB Warpage behavior.
본문·목차
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
최근 본 자료 전체보기
UCI(KEPA) : I410-151-26-02-096355630
