저자의 연구 키워드

저자의 연구 키워드

#3D Stack

#and PDMS

#Arrhenius equation

#Automatic Mooring System

#Bonder

#Bonding

#Bump deformation behaviour

#C2W

#CBM

#Chloroprene rubber(클로로프렌 고무)

#CNN

#Coarse motion stage

#Condition based maintenance

#Condition based maintenance(상태기반유지보수)

#Cutting error compensation

#Dual servo stage

#Face-down bonding

#Failure simulation database(고장 모사 데이터베이스)

#Failure simulation scenario(고장 모사 시나리오)

#Failure simulation test(고장모사 시험)

#Fault diagnosis

#filter(필터)

#Fine dust(미세먼지)

#Fine motion stage

#Finite element method

#Flexible

#Flexible package

#FOWLP

#Heat pump system(히트펌프 시스템)

#HHT

#Hybrid

#Hyperelastic behavior(초탄성 거동)

#Hyperelastic material

#Laser Debonding

#Machine learning

#Machined shape error measurement

#Maskless lithography

#Material test

#Mobile machine tool

#Nitrile butadiene rubber seal

#Nonlinear material constant(비선형 재료 정수)

#Polyimide

#Polymer elastic bump

#Precision control

#Pump

#Purifier

#Reliability

#Roll-to-roll

#Rubber Seal

#Self-origin recognition of workpiece

#SiC Heater

#SiF(System in Foil)

#Strain energy function(변형률에너지함수)

#Stretchable

#Stretchable Conductor

#Stretchable Display

#Stretchable Electronics

#Suction Performance Experiment

#Temporary Bonding and Debonding

#Thermal compression bonding

#Thermo-compression Bonding

#Thin Die

#Thin Wafer Handling

#TSV

#Uniaxial tensile test(단축인장시험)

#Vacuum pad

#Vacuum Suction Pad

#Wearable Device

#Web control

#Web handling

#Wet electrostatic precipitator(습식 전기집진기)