저자의 연구 키워드

저자의 연구 키워드

#3D packaging

#3D Packaging (3차원 패키징)

#3D Printing

#3D printing (3D 프린팅)

#3D Printing(3D 프린팅)

#3D Printing(3D프린팅)

#3D Stacking (3차원 적층)

#Additive manufacturing (적층 제조)

#Additive manufacturing (적층제조)

#Assembly(조립)

#Auto Focusing

#Auto focusing actuator(자동초점구동기)

#Automation(자동화)

#Auto-surface tracking (표면자동추종)

#Beam-structured Model(빔구조 모델)

#bed smell

#Bolted Joint(볼트 결합부)

#Camera

#Cellular camera phone(카메라 휴대폰)

#Cellular phone

#CFD

#Closed-loop control

#Commercialization

#Composite material(복합재료)

#Cu Pillar Bump (구리필러범프)

#DED

#Direct Oxide Bonding (실리콘 옥사이드 본딩)

#Dispensing

#Dosing

#drain

#Drop test(충격평가)

#dryer

#Dynamic Characteristics(동특성)

#Electronics(전자소자)

#Eutectic Metals

#Eutectic Metals(공정금속)

#Fan-out

#Finite element method(유한요소 해석)

#Finite Element Modeling(유한요소 모델링)

#food waste

#Height Measurement

#Injection molding

#Insert-Bump Bonding (삽입형 본딩)

#Laser assist metal deposition (레이저 응용 금속 증착)

#Leaf spring(판스프링)

#Lens Module(렌즈 모듈)

#Lens orientation

#Low Temperature Bonding (저온접합)

#ME

#Melt pool (용융풀)

#Metal

#Metal 3D printing

#Metal 3D printing (금속 3D 프린팅)

#Micro assembly machine

#Micro-Factory

#microwave

#Optical property

#PBF

#Phone Camera Lens Module

#Phone Camera(폰 카메라)

#Phosphor

#Plastic lens

#polymer (폴리머)

#Pores

#Porous Filter

#Printed Electronics

#Productivity

#Rotating wire feeder (회전형 와이어 공급장치)

#Self-adjustment module

#Self-alignment (자가정렬)

#Stand-off distance (스탠드 오프 거리)

#Thermoplastic material (열가소성플라스틱 재료)

#Thin Wafer Handling (박형 실리콘 핸들링)

#titanium

#TSV (실리콘 관통 비아)

#TSV (실리콘 관통비아)

#Vibration Test(진동시험)

#Wafer level package

#White LED

#x-ray tomography

#Yield