인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2000.12
- 수록면
- 511 - 520 (10page)
이용수
초록· 키워드
Ultrasonic pulse echo method comes to be difficult to apply to the multi-layered structure with very thin layer, because the echoes from the top and the bottom of the layer are superimposed. We can easily meet this problem when the silicon chip layer in the semiconductor is inspected by a SAM equipment using fairly low frequency lower than 20MHz by which severe attenuation in the epoxy mold compound of packaging material can be overcome. Conventionally, deconvolution technique has been used for the decomposition of superimposed UT signals, however it has disabilities when the waveform of the transmitted signal is distorted according to the propagation. In this paper, the wavelet transform based deconvolution (WTBD) technique is proposed as a new signal processing method that can decompose the superimposed echo signals with superior performances compared to the conventional deconvolution technique. WTBD method uses the wavelet transform in the pre-stage of deconvolution to extract out the common waveform from the transmitted and received signal with distortion. Performances of the proposed method are shown by through computer simulations using model signal with noise and are demonstrated by through experiments for the fabricated semiconductor sample with partial delamination at the top of silicon chip layer.
상세정보 수정요청해당 페이지 내 제목·저자·목차·페이지정보가 잘못된 경우 알려주세요!
목차
- 초록
- Abstract
- 1. 서론
- 2. 디컨볼루션 기법
- 3. 웨이브렛 변환 기법
- 4. 웨이브렛 변환 기반 디컨볼루션(WTBD) 기법
- 5. 시뮬레이션
- 6. SAM을 이용한 반도체 실리콘 칩의 계면 들뜸 검사에의 적용
- 7. 실험결과 및 고찰
- 8. 결론
- 참고문헌
참고문헌
참고문헌 신청최근 본 자료
UCI(KEPA) : I410-ECN-0101-2014-500-003247689
