인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
개인구독
소속 기관이 없으신 경우, 개인 정기구독을 하시면 저렴하게
논문을 무제한 열람 이용할 수 있어요.
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2020.12
- 수록면
- 294 - 301 (8page)
- DOI
- 10.33162/JAR.2020.12.20.4.294
이용수
초록· 키워드
Purpose: The purpose of this study is to verify the vibration performance of passive components of transmission controller unit’s for automobiles. In addition to soldering, which is commonly used for device application, various bonding methods were applied to enhance the vibration reliability performance of the device, which was verified and analyzed through experimental and analytical methods. In this paper, the bonding method of power inductor component in the transmission controller unit was used in four cases, which were compared and analyzed through the same vibration test and interpretation.
Methods: An experimental method was introduced to reduce the test time by applying the sine-on-random vibration mode. To increase the severity of the test, and to identify the mechanism of failure of the device, analytical methods were introduced.
Results: The vibration reliability of the component was found to be improved by the application of epoxy and silicon adhesives to the chip as well as to the normal soldering joint. The shape of the epoxy application in the lower part confirmed that the two-point application method is more advantageous than the one-point application method. Silicon on the upper part also strengthens the bonding power of the inductor.
Conclusion: In order to enhance vibration resistance performance, the epoxy and silicon application joining method for attaching chips can increase the vibration resistance performance of inductor devices when paired with the general soldering fixation method.
Methods: An experimental method was introduced to reduce the test time by applying the sine-on-random vibration mode. To increase the severity of the test, and to identify the mechanism of failure of the device, analytical methods were introduced.
Results: The vibration reliability of the component was found to be improved by the application of epoxy and silicon adhesives to the chip as well as to the normal soldering joint. The shape of the epoxy application in the lower part confirmed that the two-point application method is more advantageous than the one-point application method. Silicon on the upper part also strengthens the bonding power of the inductor.
Conclusion: In order to enhance vibration resistance performance, the epoxy and silicon application joining method for attaching chips can increase the vibration resistance performance of inductor devices when paired with the general soldering fixation method.
#Reliability Evaluation
#Transmission Control Unit
#Sine-On-Random Vibration Test
#Passive Component
#Inductor
상세정보 수정요청해당 페이지 내 제목·저자·목차·페이지정보가 잘못된 경우 알려주세요!
목차
- 1. 서론
- 2. 시험 개요
- 3. 결론
- References
참고문헌
참고문헌 신청최근 본 자료
UCI(KEPA) : I410-ECN-0101-2021-323-000046917
