저자의 연구 키워드

저자의 연구 키워드

#3D Modeling of Moving and Fixed Joints (이동형 및 고정형 결합부의 삼차원 모델링)

#3D packaging

#3D Packaging (3차원 패키징)

#3D printing

#3D printing (3D 프린팅)

#3D Stacking (3차원 적층)

#반전법(Reversal Method)

#정밀도(Accuracy)

#직각도(Squareness)

#Additive manufacturing

#Additive manufacturing (적층 제조)

#Additive manufacturing (적층제조)

#Adjoint variable methods (설계 민감도 해석)

#Assembly

#Assembly(조립)

#Automation(자동화)

#Auto-surface tracking (표면자동추종)

#bed smell

#bolt joint

#Bolt Joint (볼트결합부)

#Built-in Sensor (내장센서)

#Built-in-Sensor mold (센서장착금형)

#Cellular phone

#Commercialization

#Composite

#Computational fluid dynamics (전산 유체 역학)

#Computational Model (전산모델)

#Coordinate Transform (좌표변환)

#Cu Pillar Bump (구리필러범프)

#Damping Coefficient (감쇠계수)

#Decenter (편심)

#DED

#Design for additive manufacturing (적층 제조 특화 설계)

#Direct Oxide Bonding (실리콘 옥사이드 본딩)

#drain

#dryer

#effective angle

#Fan-out

#FEM

#FEM (유한요소해석)

#FEM Modeling Automation (FEM 모델링 자동화)

#Finite element analysis (유한요소해석)

#food waste

#Industrial site application (산업현장적용)

#Injection Mold (사출금형)

#Injection molding condition diagnosis (사출성형공정상태진단)

#Insert-Bump Bonding (삽입형 본딩)

#Lateral Stiffness

#Lens injection molding (렌즈 사출성형)

#Lens Module(렌즈 모듈)

#Lens orientation

#Lightweight design (경량화 설계)

#Low Temperature Bonding (저온접합)

#Manifold (매니폴드)

#Material extrusion

#ME

#Measurement

#Melt pool (용융풀)

#Mesh Combination of Structures and Joints (구조물과 결합부의 메쉬 연결)

#Metal

#Micro assembly machine

#Micro-Factory

#microwave

#Part consolidation (부품 일체화)

#PBF

#Phone Camera Lens Module

#Phone Camera(폰 카메라)

#Plastic Lens (플라스틱 렌즈)

#Polymer process

#precision

#pre-load

#Productivity

#Real-Time system (실시간시스템)

#Release agent (이형제)

#Self-adjustment module

#Self-alignment (자가정렬)

#Stand-off distance (스탠드 오프 거리)

#Static and Dynamic Analysis of Machine Tools (공작기계의 정적, 동적 해석)

#static stiffness

#stiffness

#Stiffness (강성)

#Thin Wafer Handling (박형 실리콘 핸들링)

#Topology optimization (위상최적화)

#TSV (실리콘 관통 비아)

#TSV (실리콘 관통비아)

#Vision

#Wafer level package

#Wood foundry mold

#Yield