저자의 연구 키워드

저자의 연구 키워드

#$Na_2SO_4$

#4-point bending strength test

#고형상비

#마이크로 터빈

#마이크로 파워 시스템)

#접합

#activation energy

#Adhesion

#Al

#Al thin film

#alloys

#Annealing

#anodic polarization

#anodization

#ANSYS Thermal-Electric

#au stud bump

#Bending endurance

#bending endurance test

#CAF

#Co

#coating

#conductive anodic filament

#Corrosion

#Cr

#Cu

#Cu contamination

#Cu damascene interconnects

#Cu drift

#Cu interconnect

#Cu pillar

#Cu pillar bump

#C-V

#CW Nd:YAG laser

#defects

#dendrite

#Dielectric breakdown

#Dynamic electric field

#ECM)

#effective modulus

#electrical conductivity/resistivity

#electrical property

#electrical resistance

#electro chemistry

#electrochemical migration

#Electrochemical migration lifetime

#electrochemistry

#Electromigration

#electronic package

#electrospinning

#Electrospinning · Selective oxidation · Selective etching · Porous carbon nanofi ber

#EMI-shielding

#eutectic SnPb

#Fatigue

#FEA)

#FEM simulation

#Finite Element Analysis

#Flexible

#Flexible interconnects

#flip chip

#folding endurance test

#furnace annealing

#growth kinetics

#hillock

#hydrogen absorbing materials

#incubation stage

#incubation time

#inkjet printing

#Ink-jet printing

#in-situ

#in-situ scanning electron microscopy

#in-situ SEM

#Interconnects

#intermetallic compound

#jL product

#Joule heating

#kirkendall void

#Lifetime

#line length dependency

#Low-k materials

#magnetic nanofibers

#major diffusion element

#mechanical reliability

#Microstructure

#Mo underlayer

#Na2SO4

#NaBr

#NaCl

#NaF

#Nano particle

#nanostructured materials

#oxide film

#oxygen partial pressure

#Pb-free solder bump

#PCB

#polarization

#porous materials

#reliability

#Resistivity

#Self-forming barrier

#side hillock

#SnAgCu

#SnPb

#SnPb solder

#solder

#solder alloys

#Stacked-Wafers Package

#stress relaxation

#TDDB

#thermal diffusion

#thermal fatigue

#Thermal Stress

#Thermochemical model

#Thermoelectric cooler

#thin film

#threshold current density

#Through-Silicon-Via

#TSV)