저자의 연구 키워드

저자의 연구 키워드

#3차원 프린팅(Additive manufacturing)

#강건설계(Robust design)

#공정(Process)

#굽힙강도(Flexural strength)

#기계적 거동(Mechanical behavior)

#다이픽업(Die Pick-up)

#물성 평가(Properties evaluation)

#박막(Thin-Film)

#반도체 패키징(Semiconductor packaging)

#반도체(Semiconductor)

#볼그리드배열(Ball Grid Array)

#솔더볼(Solder ball)

#솔더신뢰성(Solder Joint reliability)

#신뢰성(Reliability)

#실험 역학(Experimentalmechanics)

#열팽창계수(Coefficient of Thermal Expansion, CTE)

#열피로(Thermal fatigue)

#유한요소해석(Finite element analysis)

#잔류응력(Residual stress)

#전기적 특성(Electrical characteristics)

#전자패키지(Electronic package)

#전자패키징(Electronics packaging)

#치아임플란트(Dental implant)

#크리프(Creep)

#파손(Failure)

#합금(Alloy)

#화학적 특성(Chemical characteristics)

#휨(Warpage)

#Additive manufacturing (적층 제조)

#Body-Centered-Cubic(BCC)

#Compression (압축)

#Cu film(구리 박막)

#Cu thin film(구리박막)

#Deep learning(심층학습)

#Die Pick-up(다이 픽업)

#Digital Image Correlation(DIC)

#Ductile to brittle transition temperature(연·취성천이온도)

#Electron Backscatter Diffraction(EBSD)

#Electronics package(전자패키지)

#Electronics Packaging(전자 패키징)

#Experimental mechanics(실험역학)

#Fan-out Packaging(Fan-out 패키징)

#Finite Element Analysis(유한 요소 해석)

#Finite Element Analysis(유한요소해석)

#Gas turbine(가스 터빈)

#High Temperature (고온)

#Humid condition(습윤 환경)

#Mechanical behavior (기계적 거동)

#Mechanical behavior(기계적거동)

#Mechanical property(기계적 물성)

#Mechanical resonator (기계진동자)

#Micro tensile tester(미소인장기)

#Micro-tensile tester(미소인장기)

#Oriented silicon steel(방향성 전기강판)

#Polyimide(폴리이미드)

#Power amplifier (국문)

#Prepreg(Prepreg)

#Reliability(신뢰성)

#Semiconductor(반도체)

#Single crystal(단결정)

#Solder Resist (솔더 레지스트)

#Stress-Strain curve(응력-변형률 선도)

#tensile testing(인장 시험)

#Thin film (박막)

#Thin film(박막)

#Triboelectric nanogenerator (마찰대전 발전기)