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논문 기본 정보

자료유형
학술대회자료
저자정보
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대한설비공학회 대한설비공학회 학술발표대회논문집 대한설비공학회 2006년도 동계학술발표대회 논문집
발행연도
2006.11
수록면
186 - 191 (6page)

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초록· 키워드

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Although the advance in electronic technology enables large number of circuitry to be packed in small volume, it is simultaneously needed to remove the high heat load produced by them. Since the use of a finned heat sink to these electronic components is limited by manufacturing constraints and noise levels, the use of liquid cooling is a promising way of maintaining low surface temperature by dissipating the large heat flux. In this study, the heat transfer and pressure drop characteristics of a micro-channel heat exchanger, which was designed for liquid cooling of electronic components, were investigated with various operating conditions. FC-72 was used as a working fluid. The micro-channel heat exchanger was made with rectangular shape that had hydraulic diameters of 61.1 and 137.5 ㎛ in regular intervals with a channel length of 310 ㎜. A direct heating method by DC power supply, which was used to apply heat load to the test section was adapted in this experiment. The heat flux provided by direct heating method ranged from 2.3 to 27.2 ㎾/㎡. The heat transfer rate from the heat source to the working fluid was measured, and pressure drop characteristics of the test section were also investigated for single-phase flow.

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2. 실험장치 및 방법
3. 실험결과 및 고찰
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