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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2012.2
- 수록면
- 26 - 32 (7page)
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초록· 키워드
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In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.
목차
Abstract
1. 서론
2. 프린팅 공정의 압력 형성과정 해석
3. 미세범프 충진해석
4. 결론
후기
참고문헌
참고문헌 (18)
참고문헌 신청
1. [학술대회논문] - Ko, Y. K / 2009 / Via Filling Technique with Molten Solder and LowTemperature Solder Bump for 3D Packaging / Proc.2009 Fall Conference of Korean Society for PrecisionEngineering : 699 ~ 700
2. [학술지(정기간행물)] - 이재식 / 2005 / Sn-1.8Bi-0.7Cu-0.6In 솔더의 고온 시효 특성 / 마이크로전자 및 패키징학회지 12 (4) : 301 ~ 306
3. [학술지(정기간행물)] - Durairaj, R / 2009 / Rheological Characterisation of Solder Pastes and Isotropic Conductive Adhesives used for Flip-chip Assembly / J. Mater. Process. Technol 209 (8) : 3923 ~ 3930
4. [학술지(정기간행물)] - Kim, M / 2001 / A Study on Melting Phenomena of Solder Paste / J. Microelecton. Packag. Soc 8 (1) : 5 ~ 11
5. [학술지(정기간행물)] - Haslehurst, I / 1996 / Parameter Interactions in Stencil Printing of Solder Paste / J. of Electron. Manuf 6 (4) : 307 ~ 316
2. [학술지(정기간행물)] - 이재식 / 2005 / Sn-1.8Bi-0.7Cu-0.6In 솔더의 고온 시효 특성 / 마이크로전자 및 패키징학회지 12 (4) : 301 ~ 306
3. [학술지(정기간행물)] - Durairaj, R / 2009 / Rheological Characterisation of Solder Pastes and Isotropic Conductive Adhesives used for Flip-chip Assembly / J. Mater. Process. Technol 209 (8) : 3923 ~ 3930
4. [학술지(정기간행물)] - Kim, M / 2001 / A Study on Melting Phenomena of Solder Paste / J. Microelecton. Packag. Soc 8 (1) : 5 ~ 11
5. [학술지(정기간행물)] - Haslehurst, I / 1996 / Parameter Interactions in Stencil Printing of Solder Paste / J. of Electron. Manuf 6 (4) : 307 ~ 316
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UCI(KEPA) : I410-ECN-0101-2013-552-001511697