지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
이용수
초록· 키워드
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Adhesive bend and shear tests of micro-sized bonded component have been performed to clarify the relationship between effects of heat-treatment on the adhesive strength and the bonded specimen shape using Weibull analysis. Multiple micro-sized SU-8 columns with four different diameters were fabricated on a Si substrate under the same fabrication condition. Heat-treatment can improve both of the adhesive bend and shear strength. The improvement rate of the adhesive shear strength is much larger than that of the adhesive bend strength, because the residual stress, which must change by heat-treatment, should effect more strongly on the shear loading. In case of bend type test, the adhesive bend strength in the smaller diameters (50 and 75 ㎛) widely vary, because the critical size of the natural defect (micro-crack) should vary more widely in the smaller diameters. In contrast, in case of shear type test, the adhesive shear strengths in each diameter of the columns little vary. This suggests that the size of the natural defects may not strongly influence on the adhesive shear strength. All the result suggests that both of the adhesive bend and shear strengths should be complicatedly affected by heat-treatment and the bonded columnar diameter.
목차
Abstract
1. Introduction
2. Experimental
3. Results and Discussion
4. Conclusions
References
참고문헌 (13)
참고문헌 신청
1. [기타자료] - / 2011 / International Technology Roadmap for Semiconductors(ITRS) 2011 Ed. (Executive Summary) : 1 ~ 12
2. [학술지(정기간행물)] - R. T. Howe / 1988 / Surface micromachining for microsensors and microactuators / J. Vac. Sci. Technol. B 6 : 1809 ~ 1813
3. [학술지(정기간행물)] - K. A. Shaw / 1994 / SCREAM 1: a single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures / Senc. Actuators A 40 : 63 ~ 70
4. [학술지(정기간행물)] - E. Bassous / 1978 / Fabrication of novel three-dimensional microstructures by anisotropic etching of (100) and (110) silicon / IEEE Trans. Electron Devices ED-25 : 1178 ~ 1185
5. [학술지(정기간행물)] - W. Bacher / 1995 / The LIGA technique and its potential for microsystems-a survey / IEEE Trans. Electron 42 : 431 ~ 441
2. [학술지(정기간행물)] - R. T. Howe / 1988 / Surface micromachining for microsensors and microactuators / J. Vac. Sci. Technol. B 6 : 1809 ~ 1813
3. [학술지(정기간행물)] - K. A. Shaw / 1994 / SCREAM 1: a single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures / Senc. Actuators A 40 : 63 ~ 70
4. [학술지(정기간행물)] - E. Bassous / 1978 / Fabrication of novel three-dimensional microstructures by anisotropic etching of (100) and (110) silicon / IEEE Trans. Electron Devices ED-25 : 1178 ~ 1185
5. [학술지(정기간행물)] - W. Bacher / 1995 / The LIGA technique and its potential for microsystems-a survey / IEEE Trans. Electron 42 : 431 ~ 441
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UCI(KEPA) : I410-ECN-0101-2014-500-003280440