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논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2013.12
- 수록면
- 3,328 - 3,332 (5page)
이용수
초록· 키워드
As the electronic devices is more accelerated the compact size, the light-weight and the high integrated trend of electronic components, the most increasingly the heat generation problem rises. Recently, there are growing interests in developing alternative heat sink devices. Vapor chamber heat sinks are heat-spreading systems that develop phase change to spread heat and are of increasing interest in the electronics industry. Vapor chambers are increasingly being investigated as a way to spread the heat generated by an electronic component to the base of a heat sink for typical heat sink applications. In this study, vapor chamber heat sinks have been performed to investigate the thermal performances under the natural convection and forced convection conditions and to compare their performance against copper base heat sink. It is fabricated to be used a real telecommunication equipment specifications. The thermal characteristics of vapor chamber heat sinks are studied according to various input power using dummy heater, test jig and fan. The study shows that vapor chamber heat sinks can thermally perform better than a copper block heat sink. The thermal conductivity of the vapor chamber is also numerically analyzed using CFD simulation and is compared to the experiment results. Thus vapor chamber heat sinks provide good performance alternative to typical heat sinks.
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목차
- Abstract
- 1. 서론
- 2. 기본구조 및 작동원리
- 3. 실험장치 및 실험방법
- 4. 결과 및 검토
- 5. 결론
- 참고문헌
참고문헌
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