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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2014.11
- 수록면
- 1,345 - 1,356 (12page)
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초록· 키워드
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The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.
목차
Abstract
I. INTRODUCTION
II. THERMAL BEHAVIOR OF THE STUDIED MODULE
III. THERMAL INFLUENCES IN HYBRID STRUCTURES
IV. CONCLUSIONS
REFERENCES
참고문헌 (34)
참고문헌 신청
1. [학술지(정기간행물)] - N. Y. A. Shammas / 2002 / A simple method for evaluating the transient thermal response of semiconductor devices / Microelectronics Reliability 42 (1) : 109 ~ 117
2. [학술지(정기간행물)] - A. Hamidi / 1998 / Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications / Microelectronics Reliability 38 (6-8) : 1353 ~ 1359
3. [학술지(정기간행물)] - Z. Khatir / 2004 / Boundary element analysis of thermal fatigue effect son high power IGBT modules / Microelectronics Reliability 44 (6) : 929 ~ 938
4. [학술지(정기간행물)] - S. Carubelli / 2003 / Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions / Microelectronics Journal 34 (12) : 1143 ~ 1151
5. [기타자료] - COSMOS/M / 1999 / GeoStar 2.5 Copyright (C) / USA
2. [학술지(정기간행물)] - A. Hamidi / 1998 / Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications / Microelectronics Reliability 38 (6-8) : 1353 ~ 1359
3. [학술지(정기간행물)] - Z. Khatir / 2004 / Boundary element analysis of thermal fatigue effect son high power IGBT modules / Microelectronics Reliability 44 (6) : 929 ~ 938
4. [학술지(정기간행물)] - S. Carubelli / 2003 / Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions / Microelectronics Journal 34 (12) : 1143 ~ 1151
5. [기타자료] - COSMOS/M / 1999 / GeoStar 2.5 Copyright (C) / USA
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UCI(KEPA) : I410-ECN-0101-2015-500-002645498