지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- Korean Society for Precision Engineering Journal of the Korean Society for Precision Engineering 한국정밀공학회지 Vol.31 No.12
- 발행연도
- 2014.12
- 수록면
- 1,077 - 1,083 (7page)
이용수
초록· 키워드
오류제보하기
Multi-material Additive Manufacturing (AM) is being focused to apply for direct manufacturing of a product. In this paper, a three-dimensional circuit device (3DCD) fabrication technology based on the multi-material AM technology was proposed. In contrast with conventional two-dimensional Printed Circuit Board (PCB), circuit elements and conducting wires of 3DCD are placed in threedimensional configuration at multiple layers of the structure. Therefore, 3DCD technology can improve design freedom of an electronic product. In this paper, 3DCD technology is proposed based on AM technology. Two types of 3DCD fabrication systems were developed based on the Stereolithography and the Fused Deposition Modeling technologies. And the 3DCD samples which have same function were fabricated, successfully.
목차
1. 서론
2. 공정계획
3. 시스템의 구성
4. 3차원 조도센서의 제작
5. 결론
REFERENCES
참고문헌 (15)
참고문헌 신청
Vunnam, S. / 2013 / Surface Modification of Indium Tin Oxide for Direct Writing of Silver Nanoparticulate Ink Micropatterns / Thin Solid Films 531:294~301
Church, K. H. / 2000 / Commercial applications and Review for Direct Write Technologies / MRS Proceedings, Cambridge Univ. Press 624:3~8
Carter, P. W. / 2001 / Advances in Rapid Prototyping and Rapid Manufacturing / Proc. of the Electrical/Electronic Insulation Conference :107~114
Oh, S. T. / 2013 / 3-Dimensional Circuit Fabrication based on the FDM Technology / Proc. of KSMPE Autumn Conference
Jang, S. H. / 2013 / 3-Dimensional Circuit Fabrication based on Solid Freeform Fabrication / Proc. of The 5 th International Conference on Manufacturing, Machine Design and Tribology
Church, K. H. / 2000 / Commercial applications and Review for Direct Write Technologies / MRS Proceedings, Cambridge Univ. Press 624:3~8
Carter, P. W. / 2001 / Advances in Rapid Prototyping and Rapid Manufacturing / Proc. of the Electrical/Electronic Insulation Conference :107~114
Oh, S. T. / 2013 / 3-Dimensional Circuit Fabrication based on the FDM Technology / Proc. of KSMPE Autumn Conference
Jang, S. H. / 2013 / 3-Dimensional Circuit Fabrication based on Solid Freeform Fabrication / Proc. of The 5 th International Conference on Manufacturing, Machine Design and Tribology
이 논문의 저자 정보
이 논문과 함께 이용한 논문
Performance Characteristics of a Soft Gripper Fabricated by Additive Manufacturing Process
정우진
,
박채영
,
신종호
외 1명
Journal of the Korean Society for Precision Engineering
2023
.10
Multi-Material Additive Manufacturing Process for 3-Dimensional Circuit Device Fabrication
오성택
,
이인환
,
김호찬
외 1명
Journal of the Korean Society for Precision Engineering
2018
.03
최근 본 자료
댓글(0)
0
UCI(KEPA) : I410-ECN-0101-2015-550-002897869