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리플로우 시간에 따른 Sn-4Ag 솔더접합부 FEM 전단해석 Shear Evaluation of Sn-4Ag Solder Joints by FEM with Reflow Time
피인용 0
리플로우 시간에 따른 Sn-4Ag 솔더접합부 FEM 전단해석
초록·키워드
The evaluation on reliability of environment-friendly Pb-free solder and solder joints is very important. The correlation between interface reaction and mechanical properties of solder joints was confirmed in this study.
And shear test are performed using SP(Share-Punch) tester. The shear strength tests on various reflow time are performed at 10,30,00 and 300sec. Tested specimens were examined in order to observe the failure mode on solder joints. The test result about solder joints of two different plate(Ni and Cu plate) are compared. Ni plate joints shown low IMC growth rate. The shear strength of Pb-free solder joints are higher than Sn-37 Pb solder joints, generally. In the case of Cu plate, shear strength of Sn-4Ag solder joints increased with reflow time. And solder joints with Cu contents are seems to similar in strength regardless of reflow time. on the other hand, in the case of Ni plate joints, shear strength of Sn-37Pb solder joints are similar to Sn-4Ag solder joints. Like Cu plate joints, solder joints with Cu contents are seems to similar in strength regardless of reflow time.
And shear test are performed using SP(Share-Punch) tester. The shear strength tests on various reflow time are performed at 10,30,00 and 300sec. Tested specimens were examined in order to observe the failure mode on solder joints. The test result about solder joints of two different plate(Ni and Cu plate) are compared. Ni plate joints shown low IMC growth rate. The shear strength of Pb-free solder joints are higher than Sn-37 Pb solder joints, generally. In the case of Cu plate, shear strength of Sn-4Ag solder joints increased with reflow time. And solder joints with Cu contents are seems to similar in strength regardless of reflow time. on the other hand, in the case of Ni plate joints, shear strength of Sn-37Pb solder joints are similar to Sn-4Ag solder joints. Like Cu plate joints, solder joints with Cu contents are seems to similar in strength regardless of reflow time.
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UCI(KEPA) : I410-ECN-0101-2016-556-001596309
