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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2008.1
- 수록면
- 434 - 439 (6page)
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Silver pastes as the outer electrodes have been prepared using Pb-free glass frits with different content of Bi₂O₃ and the effects of glass composition on the degradation behaviors of the Ag electrodes were investigated using the change of adhesion between Ag electrode and alumina substrate with thermal cycle stress. Low adhesion and high surface resistance were observed in Ag electrode using glass frit with a Bi2O3 content of 60 wt%, owing to the open microstructure formed at the firing temperature of 600 °C. When the Bi₂O₃ was increased to 80 wt% in the glass frit, the Ag electrodes had a dense microstructure with high adhesion and a low surface resistance. Delamination of the Ag electrodes was a major failure mode under thermal cycle stress and this was attributed to residual stress due to the thermal expansion mismatch between the Ag electrode and the alumina substrate.
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참고문헌 (14)
참고문헌 신청
/ 2003 / Directives on the restriction of the use of certain hazardous substances in electrical and electronic equipment, European Union, Brussels, 2003
B.S. Lee / 1999 / Sintering behavior and electrical properties of Ag thick film conductors with fast firing / J. Kor. Institute of electrical and electronic material engineer
C.S. Lee / 2001 / Fabrication of Pb free solder glass for electronic packaging application / J. Kor. Ceram. Soc 38 : 628 ~
D.W. Hamer / 1972 / Thick Film Hybrid Circuit Technology / Wiley Inter
H.S. Kim / 2003 / Preparation and characterization of Bi based frit for Ag electrode in PDP application / J. of Microelectronics & Packaging Soc 10 : 47 ~
B.S. Lee / 1999 / Sintering behavior and electrical properties of Ag thick film conductors with fast firing / J. Kor. Institute of electrical and electronic material engineer
C.S. Lee / 2001 / Fabrication of Pb free solder glass for electronic packaging application / J. Kor. Ceram. Soc 38 : 628 ~
D.W. Hamer / 1972 / Thick Film Hybrid Circuit Technology / Wiley Inter
H.S. Kim / 2003 / Preparation and characterization of Bi based frit for Ag electrode in PDP application / J. of Microelectronics & Packaging Soc 10 : 47 ~
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