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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2020.3
- 수록면
- 17 - 26 (10page)
이용수
초록· 키워드
It is clear that monocrystalline Silicon (Si) ingots are the key raw material for semiconductors devices. In the present industries markets, most of monocrystalline Silicon (Si) ingots are made by Czochralski Process due to their advantages with low production cost and the big crystal diameters in comparison with other manufacturing process such as Float-Zone technique. However, the disadvantage of Czochralski Process is the presence of impurities such as oxygen or carbon from the quartz and graphite crucible which later will resulted in defects and then lowering the efficiency of Si wafer. The heat transfer plays an important role in the formation of Si ingots. However, the heat transfer generates convection in Si molten state which induces the defects in Si crystal. In this study, a crystal growth simulation software was used to optimize the Si crystal growth process. The furnace and system design were modified. The results showed the melt-crystal interface shape can affect the Si crystal growth rate and defect points. In this study, the defect points and desired interface shape were controlled by specific crystal growth rate condition.
#Melt-Crystal Interface shape,Crystal Growth rate
#Defect point
#Crystal Growth Simulation
#Silicon Ingot
#Czochralski process
상세정보 수정요청해당 페이지 내 제목·저자·목차·페이지정보가 잘못된 경우 알려주세요!
목차
- ABSTRACT
- 1. 서론
- 2. 수학적 모델링 & 이론
- 3. Melt - Crystal interface
- 4. Improve of the czochralski process by Crystal Growth - Simulation
- 5. Result and discussion
- 6. Conclusion
- References
참고문헌
참고문헌 신청최근 본 자료
UCI(KEPA) : I410-ECN-0101-2020-530-000465091