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논문 기본 정보

자료유형
학술대회자료
저자정보
김정현 (전북대학교) 안지호 (전북대학교) 이교우 (전북대학교)
저널정보
대한기계학회 대한기계학회 춘추학술대회 대한기계학회 2019년 학술대회
발행연도
2019.11
수록면
2,159 - 2,162 (4page)

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초록· 키워드

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In this study, the deformation of a guide roller of the multi-wire saw was analyzes with the variation of the design parameters like length, diameter and thickness of the roller. The roller could be deformed by tensioned saw wires during cutting. We attempted to suggest a range of design variables that would satisfy the desirable wafer thickness variation. The analysis conditions were verified by comparing the experimental result with that of simulation, and the deformation of the modeled rollers was analyzed with several parameters. CATIA V5R21, a co㎜ercial drawing program, was used to model rollers similar to those of the actual multi-wire saw in various lengths, diameters and thicknesses, and were analyzed by ANSYS 17, a co㎜ercial analysis program. As a result of analysis, the larger the diameter, the shorter the length, and the thicker the thickness, the smaller the deformation of the roller. In addition, when the length-to-diameter ratio and the thickness-to-length ratio were the same, the shorter the length, the smaller the deformation. Based on the results, under the given conditions, when the length-to-diameter ratio was 1.5 or less and the thickness-to-length ratio was 0.17 or more, the deformation of the roller could be predicted within 5 ㎛, which was the design criterion in this study.

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Abstract
1. 서론
2. 실험 및 해석
3. 결과 및 고찰
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