개인구독
소속 기관이 없으신 경우, 개인 정기구독을 하시면 저렴하게
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지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2017.1
- 수록면
- 361 - 369 (9page)
이용수
초록· 키워드
오류제보하기
Electromechanical impedance method as an efficient tool in Structural Health Monitoring (SHM) utilizes the electromechanical impedance of piezoelectric materials which is directly related to the mechanical impedance of the host structure and will be affected by damages. In this paper, electromechanical impedance of piezoelectric patches attached to simply support rectangular plate is determined theoretically and experimentally in order to detect damage. A pairs of piezoelectric wafer active sensor (PWAS) patches are used on top and bottom of an aluminum plate to generate pure bending. The analytical model and experiments are carried out both for undamaged and damaged plates. To validate theoretical models, the electromechanical impedances of PWAS for undamaged and damaged plate using theoretical models are compared with those obtained experimentally. Both theoretical and experimental results demonstrate that by crack generation and intensifying this crack, natural frequency of structure decreases. Finally, in order to evaluate damage severity, damage metrics such as Root Mean Square Deviation (RMSD), Mean Absolute Percentage Deviation (MAPD), and Correlation Coefficient Deviation (CCD) are used based on experimental results. The results show that generation of crack and crack depth increasing can be detectable by CCD.
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