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- 학술저널
- 저자정보
- 발행연도
- 2015.1
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- 1 - 5 (5page)
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This paper deals with the residual stresses developed in an epoxy film deposited on Si wafer. First, chemically induced residual stresses due to the volumetric shrinkage in cross-linking resins during polymerization are treated. The curvature measurement method is employed to investigate the residual stresses. Then, thermally induced stresses are investigated along the interface between the epoxy film and Si wafer. The boundary element method is employed to investigate the whole stresses in the film. The singular stress is observed near the interface corner. Such residual stresses are large enough to initiate interface delamination to relieve the residual stresses.
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참고문헌 (8)
참고문헌 신청
L.B. Freund / 2003 / Thin Film Materials
G.G. Stoney / 1909 / Proceedings of the Royal Society(London) A82:172
S.P. Timoshenko / 1925 / Journal of the Optical Society of America 11:233
L.B. Freund / 2000 / Journal of the Mechanics and Physics of Solids 48:1159
J.T. Pan / 1984 / A / Journal of Applied Physics 55:2874
G.G. Stoney / 1909 / Proceedings of the Royal Society(London) A82:172
S.P. Timoshenko / 1925 / Journal of the Optical Society of America 11:233
L.B. Freund / 2000 / Journal of the Mechanics and Physics of Solids 48:1159
J.T. Pan / 1984 / A / Journal of Applied Physics 55:2874
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