Influence of Fe Addition on Microstructure and Properties of Cu-Ag Composite

Xiaowei Zuo; Jianzheng Zhu; Bailing An; Ke Han; Rui Li; Engang Wang

추천

검색

자료유형: 학술저널

저자정보: Xiaowei Zuo (Northeastern University) Jianzheng Zhu (Northeastern University) Bailing An (Northeastern University) Ke Han (Florida State University) Rui Li (Northeastern University) Engang Wang (Northeastern University)

저널정보: 대한금속·재료학회 Metals and Materials International Metals and Materials International Vol.23 No.5

발행연도: 2017.1

수록면: 974 - 983 (10page)

이용수

📌

연구주제

📖

연구배경

🔬

연구방법

🏆

연구결과

초록· 키워드

오류제보하기

We investigated the effects of Fe content on microstructure and properties in as-cast and as-drawn Cu-(5.1-x)vol%Ag-x vol%Fe alloys. In microscale, increasing Fe content first refined and then coarsened Cu dendrites. Innanoscale, the size and length of Ag precipitates in Fe-doped alloys were smaller than the size and length of Ag precipitatesin Fe-free alloy, and the γ-Fe precipitates in Cu-2.9 vol%Ag-2.4 vol%Fe alloy were finer than the γ-Feprecipitates in Cu-5.1 vol%Fe alloy. The maximum hardness in as-cast Cu-Ag-Fe alloys was found in the Cu-2.9vol%Ag-2.4 vol%Fe alloy. With increasing drawing strain, both ultimate tensile strength and hardness of Cu-Ag-Fe composites were increased. Simulation data among the relative volume fractions of Fe, hardness and electricalconductivity showed that, as the relative value approached 40%, the Cu-Ag-Fe composite displayed greater hardnessthan other samples. As a small amount of Ag was replaced by Fe, the electrical conductivity decreased significantlywith a descending slope of approximately 3%IACS (International Annealed Copper Standard) per vol%Fe. As 47 vol%Ag was replaced by Fe, however, the electrical conductivity decreased by 51% and remainedalmost invariable with further increasing Fe content. After annealing at 450 °C for 4 h, the electrical conductivityof the Cu-2.9 vol%Ag-2.4 vol%Fe composite was elevated up to 68.3%IACS from 38.5%IACS.

참고문헌 (77)

참고문헌 신청

Y. Sakai / 1991 / Appl. Phys. Lett 59:2965

K. Han / 2000 / IEEE T. Appl. Supercon 10:1277

K. Miyake / 2000 / Jpn. J. Appl. Phys., Part 2 39:119

D. Raabe / 2000 / Mat. Sci. Eng. A-Struct 291:186

D. Raabe / 1998 / Acta Mater 46:5973

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!