Improvements of Mechanical Fatigue Reliability of Cu Interconnects on Flexible Substrates through MoTi Alloy Under-Layer

이영주                                    /Young-Joo Lee; 신해아슬; 남대현                                         /Dae-Hyun Nam; 연한율                                         /Han-Wool Yeon; 남보애                                         /Boae Nam; 우규희; 주영창                                         /Joo Young Chang

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자료유형: 학술저널

저자정보: 이영주 /Young-Joo Lee 신해아슬 남대현 /Dae-Hyun Nam 연한율 /Han-Wool Yeon 남보애 /Boae Nam 우규희 주영창 /Joo Young Chang

저널정보: 대한금속·재료학회 Electronic Materials Letters Electronic Materials Letters Vol.11 No.1

발행연도: 2015.1

수록면: 149 - 154 (6page)

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The mechanical fatigue of Cu films and lines on flexible substrates was investigated,and an improvement in the structures through the use of a MoTi alloy under-layerwas proposed. Fatigue reliability was decreased by 3-fold in lines compared withfilms in the tensile condition and by 6-fold in the compressive condition. Crackformation was observed to be more detrimental for lines than for films. With a MoTiunder-layer, the fatigue limit was increased by 2 times that of a structure withoutMoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improvedthe fatigue reliability under compressive bending.

#flexible electronics #mechanical reliability #fatigue #Cu interconnects

참고문헌 (21)

참고문헌 신청

D. -H. Kim / 2011 / Science 333:838

T. Sekitani / 2012 / MRS Bulletin 37:236

H. Fujikake / 2004 / Displays 25:3

A. K. Pandey / 2006 / Appl. Phys. Lett 89:213506

Do-Il Kim / 2012 / Effects of Piezoresistivity of Pentacene Channel in Organic Thin Film Transistors under Mechanical Bending / Electronic Materials Letters 8(1):11~16

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