인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
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지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 대한전자공학회 JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE Journal of Semiconductor Technology and Science Vol.23 No.5
- 발행연도
- 2023.10
- 수록면
- 251 - 257 (7page)
- DOI
- 10.5573/JSTS.2023.23.5.251
이용수
초록· 키워드
At SK hynix Wafer Level Package (WLPKG) line, there are plenty of measuring and inspection steps to ensure the quality of High Bandwidth Memory (HBM). Although most of the measuring and inspection steps are handled automatically, some of the steps still need confirmation from line operators with their naked eye and skills. Since the operators" skills are different, sometimes it causes human errors, and these risks become chronic problems for the company. To solve this problem, Package & Test (P&T) group at SK hynix has been steadily promoting the inspection automation system using deep learning. However, deep learning has the disadvantage of not providing interpretation information, such as which area is actually defective in the target image and its shape for the ‘Excellent’ result of outputs. In this paper, we will introduce cases in which defect patterns are automatically extracted from inspection images taken during the SiN / SiO2 film deposition process by using two deep-learning segmentation models. The performance of the technology to be introduced was demonstrated by comparing the Mean IoU value between the extracted defect image and label mask. Through the proposed technology, we intend to contribute to unmanned inspection verification tasks in the future and accelerate the realization of Industry 4.0.
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목차
- Abstract
- I. INTRODUCTION
- II. RELATED RESEARCH: DEEP LEARNING SEGMENTATION MODELS
- III. EXPERIMENT
- IV. EXPERIMENT RESULT
- V. CONCLUSION
- REFERENCE
참고문헌
참고문헌 신청최근 본 자료
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