인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
개인구독
소속 기관이 없으신 경우, 개인 정기구독을 하시면 저렴하게
논문을 무제한 열람 이용할 수 있어요.
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 저자정보
초록·키워드
Selective etching of GaN over AlGaN is a critical process step in GaN-based high electron mobility transistor (HEMT) fabrication, where precise removal of GaN is required without damaging the thin AlGaN barrier. In this study, we developed a high-selectivity, low-damage etching process using a customized BCl₃/SF<sub>6</sub> inductively coupled plasma reactive ion etching (ICP-RIE) system. Specifically, a 27.12 MHz helical resonance ICP source was utilized to generate high-density radicals and maximize gas dissociation efficiency, while the substrate temperature was precisely controlled using an external oil-circulating bath. The effects of gas composition and substrate temperature on etch rates, selectivity, and surface properties were systematically investigated. By optimizing the gas ratio to 30% SF<sub>6</sub>, a record-high GaN-over-AlGaN selectivity of 78:1 was obtained while maintaining a fast GaN etch rate. Temperature-dependent studies revealed that Al-F passivation was stable at low temperatures, whereas it degraded above 40 ℃, resulting in a significant decrease in selectivity. Although low temperatures enhanced passivation, they also promoted AlCl₃ residue oxidation, resulting in unintended surface roughening. At an intermediate temperature of ∼30℃, the etched surface exhibited the best overall characteristics, including smooth morphology, stable chemical states, and minimized leakage current. These results demonstrate that selective, high-throughput, and low-damage GaN etching can be realized by combining optimized BCl₃/SF<sub>6</sub> chemistry with precise substrate temperature control and high-frequency ICP operation.
본문·목차
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
최근 본 자료 전체보기
UCI(KEPA) : I410-151-26-02-096406801