인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
피인용 0
초록·키워드
Purpose: This study statistically analyzed solder void characteristics and their thermal effects in automotive LEDs to better understand void behavior and contribute to establishing acceptance criteria and process control guidelines.
Methods: Solder coverage and void ratios were evaluated using X-ray inspection and ImageJ analysis. Process capability was statistically assessed through normality and C<sub>pk</sub> analysis. Voids were classified into macro- and micro-types. Thermal quality was examined via Z<sub>th</sub>(t) and structure function a(z), with Pearson correlation, Mutual Information, and Hoeffding’s D applied. The relationship between solder voids and LED temperature rise (ΔT<sub>s</sub>) was also analyzed under production-equivalent measurement conditions.
Results: Solder coverage showed C<sub>pk</sub> > 1, with all void ratios below 25%, confirming process capability. Pad size influenced void distribution, peaking at an intermediate size before declining with further enlargement.
Thermal pad voids and macrovoids were the main contributors, showing weak but consistent correlations with Z<sub>th</sub>(t) and a(z). No significant correlation was found between voids and ΔT<sub>s</sub>, indicating negligible thermal impact within the IPC 25% limit.
Conclusion: It is more effective to control voids in specific pads and macrovoids rather than pursuing uniform minimization. Establishing tailored void management standards that reflect product structures and operating environments can guide automotive LED manufacturers n process design. Since this study did not include void levels beyond the 25% limit, extended research is required.
Methods: Solder coverage and void ratios were evaluated using X-ray inspection and ImageJ analysis. Process capability was statistically assessed through normality and C<sub>pk</sub> analysis. Voids were classified into macro- and micro-types. Thermal quality was examined via Z<sub>th</sub>(t) and structure function a(z), with Pearson correlation, Mutual Information, and Hoeffding’s D applied. The relationship between solder voids and LED temperature rise (ΔT<sub>s</sub>) was also analyzed under production-equivalent measurement conditions.
Results: Solder coverage showed C<sub>pk</sub> > 1, with all void ratios below 25%, confirming process capability. Pad size influenced void distribution, peaking at an intermediate size before declining with further enlargement.
Thermal pad voids and macrovoids were the main contributors, showing weak but consistent correlations with Z<sub>th</sub>(t) and a(z). No significant correlation was found between voids and ΔT<sub>s</sub>, indicating negligible thermal impact within the IPC 25% limit.
Conclusion: It is more effective to control voids in specific pads and macrovoids rather than pursuing uniform minimization. Establishing tailored void management standards that reflect product structures and operating environments can guide automotive LED manufacturers n process design. Since this study did not include void levels beyond the 25% limit, extended research is required.
본문·목차
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