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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 한양대학교 청정에너지연구소 Journal of Ceramic Processing Research Journal of Ceramic Processing Research 제10권 제6호
- 발행연도
- 2009.12
- 수록면
- 729 - 738 (10page)
이용수
초록· 키워드
A micro-conductive pattern was fabricated on an insulating substrate (SiO2) surface using a direct laser writing method known
as laser-induced forward transfer (LIFT). The LIFT process, employing a multi-scan mode laser, fabricated the microconductive
pattern using an electroless nickel plating procedure as a method for improving the deposition process of the seed
pattern on the insulating substrate surface and the electrical conductivity of the pattern. In the multi-scan mode LIFT process,
when the laser beam irradiates a thin metal film, the photon energy is absorbed by the film and converted into thermal energy,
and the thermal decomposition reaction produced by the resulting heat conduction forms a deposit on the substrate. This
paper analyzes the impact of seed pattern formation by LIFT, and the impact of key variables in the electroless nickel plating
process, on the micro-conductive pattern fabrication, using scanning electron microscopy (SEM) and an optical microscope.
It also examines the impact of the process variables on the cross-sectional shape and surface quality of the deposited pattern.
#Laser induced forward transfer (LIFT)
#Laser induced forward transfer (LIFT)
#Laser direct writing
#Laser direct writing
#Microdeposition
#Microdeposition
#Electroless nickel plating
#Electroless nickel plating
#Deed layer
#Deed layer
#Micro patterning
#Micro patterning
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