인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
DBpia AI
AI 에이전트
AI 아이디어
AI 리더
AI 뷰어
Citeasy
크롬 서지관리 다운로드
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록·키워드
Three-dimensional (3D) conductive structures significantly reduce flexible circuit complexity and enhance circuit integration. Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects. The printing resolution is, however, highly dependent on the needle size. A micro-printing method was proposed based on fluid drawing to fabricate freestanding 3D conductive structures. The delicate structure is drawn out under the tension when printing. The printing material is a high-viscosity ink composed of silver nanoparticles (AgNPs) and polyvinylpyrrolidone (PVP). The viscosity is controlled by evaporating the ink's solvent for drawing prints. This unique printing method utilizes a single needle, controlled by precise air pressure and speed, to construct 3D filamentary structures with varied wire widths. The 3D conductive structures exhibit superior structural retention and enhanced conductivity by thermal treatment. The drawing printing method has been successfully implemented on flexible circuits, including light-emitting diode (LED) arrays, thermal imaging displays, and multivibrator circuits. This work establishes a novel paradigm for flexible electronics manufacturing through fluid-drawing printing, achieving unprecedented customization and compatibility in fabricating 3D interconnects.
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
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