인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록·키워드
ABSTRACT In the early 2000s, the soldering industry faced a major shift due to regulations restricting Pb usage. As a result, four main alloy systems emerged as alternatives: Sn–Bi, Sn–In, Sn–Cu, and Sn–Ag. However, for reasons not initially evident, higher melting point alloys were the first to be widely developed, most notably the Sn–Ag–Cu (SAC) alloys, which became the industry standard due to their balanced performance in reliability, mechanical strength, and process compatibility. Over the past decade, increasing emphasis has been placed on low‐temperature soldering (LTS), requiring studies not only on defects such as warpage, interfacial pores, and joint strength but also on the fundamental melting and solidification behavior of these alloys. Sn–Bi alloys have emerged as a commercial alternative, particularly for consumer products such as clients and server computers, while maintaining compatibility with surface mount technology (SMT) technology for high‐volume manufacturing. The thermal fatigue reliability of Sn–Bi is also well‐recognized. This short review will provide an overview of various studies conducted on the solidification behavior of Sn–Bi based alloys. The solidification paths, eutectic formation, morphologies, and properties will be explored. Future research directions comprise microalloying insights to improve ductility, interaction between Sn–Bi solder balls and SAC (Sn–Ag–Cu) pastes to mitigate PCB warpage, and exploring advanced characterization techniques such as X‐ray microtomography (XMT) and nanohardness testing. These developments are essential for optimizing LTS alloys and ensuring their reliability in next‐generation electronic packaging.
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.