인문학
사회과학
자연과학
공학
의약학
농수해양학
예술체육학
복합학
지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록·키워드
Among the high-performance polymers (HPPs) deployed in material extrusion 3D printing, thermoplastic polyimide (PI or TPI) dominates in terms of chemical stability and thermomechanical performance. Such features, suitable for challenging operational environments, nationalize and defend the remarkably expensive filament market. This study comprehensively explores the physical, thermal, rheological, key mechanical, and strain rate sensitivity metrics of PI. The PI pellets were melt-extruded into filaments under optimized thermomechanical control settings. A detailed experimental course, including elemental and chemical characterization, scanning electron microscopy morphological assessments, and Raman spectroscopy, was implemented. Thermal stability and phase transitions were determined using differential scanning calorimetry and thermogravimetric analysis. The rheological response was determined through viscosity/stress tests and melt flow rate measurements at various temperatures. A dynamic mechanical analysis was performed. Moreover, standard quasi-static mechanical tests documented the tensile, bending, impact, and microhardness performance of 3D printed specimens. Finally, the strain rate sensitivity metrics of the PI were derived from forty-five 3D printed tensile specimens subjected to nine steps with elongation speeds ranging from 10 to 300 mm min<sup>-1</sup>. Remarkably, the sample tested at 25 mm min<sup>-1</sup> exhibited optimal mechanical performance, whereas a superior toughness was observed at 300 mm min<sup>-1</sup>. The strain rate sensitivity index and various other rate-dependent interactions were determined and comprehensively discussed. The inclusive findings herein provide critical insights into the overall performance of thermoplastic polyimide in additive manufacturing, aiming to support its broader exploitation in advanced engineering applications.
인공지능 문자 인식 모델을 통해 추출된 텍스트로, 일부 오타나 오류가 포함될 수 있으나 지속적으로 개선 중입니다.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.
오류를 발견하셨다면 해당 부분을 드래그한 후 ' 를 통해 신고해주세요.