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논문 기본 정보

자료유형
학술저널
저자정보
(Korea Institute of Industrial Technology (KITECH)) (Korea Institute of Industrial Technology (KITECH)) (Korea Institute of Industrial Technology (KITECH))
저널정보
한국마이크로전자및패키징학회 마이크로전자 및 패키징학회지 마이크로전자 및 패키징학회지 제31권 제3호
발행연도
수록면
91 - 98 (8page)

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초록· 키워드

This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest “theoretically” possible temperature of 145 °C. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 °C, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 °C. In particular, it is interesting to note that in the pressure sintering bonding process at 145 °C, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 °C, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 °C, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.
#Ag nano-porous sheet #Sheet bonding #Power module #Pressure bonding process #Mechanical strength
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