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논문 기본 정보

자료유형
학술저널
저자정보
나봉권 (한국산업기술대학교) 강찬형 (한국산업기술대학교)
저널정보
한국표면공학회 한국표면공학회지 한국표면공학회지 제46권 제2호
발행연도
2013.4
수록면
68 - 74 (7page)

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For the coating of diamond films on WC-Co tools, a buffer interlayer is needed because Co catalyzes diamond into graphite. W and Ti were chosen as candidate interlayer materials to prevent the diffusion of Co during diamond deposition. W or Ti interlayer of 1 μm thickness was deposited on WC-Co substrate under Ar in a DC magnetron sputter. After seeding treatment of the interlayer-deposited specimens in an ultrasonic bath containing nanometer diamond powders, 2 μm thick nanocrystalline diamond (NCD) films were deposited at 600oC over the metal layers in a 2.45 GHz microwave plasma CVD system. The crosssectional morphology of films was observed by FESEM. X-ray diffraction and visual Raman spectroscopy were used to confirm the NCD crystal structure. Micro hardness was measured by nano-indenter. The coefficient of friction (COF) was measured by tribology test using ball on disk method. After tribology test, wear tracks were examined by optical microscope and alpha step profiler. Rockwell C indentation test was performed to characterize the adhesion between films and substrate. Ti and W were found good interlayer materials to act as Co diffusion barriers and diamond nucleation layers. The COFs on NCD films with W or Ti interlayer were measured as less than 0.1 whereas that on bare WC-Co was 0.6~1.0. However, W interlayer exhibited better results than Ti in terms of the adhesion to WC-Co substrate and to NCD film. This result is believed to be due to smaller difference in the coefficients of thermal expansion of the related films in the case of W interlayer than Ti one. By varying the thickness of W interlayer as 1, 2, and 4 μm with a fixed 2 μm thick NCD film, no difference in COF and wear behavior but a significant change in adhesion was observed. It was shown that the thicker the interlayer, the stronger the adhesion. It is suggested that thicker W interlayer is more effective in relieving the residual stress of NCD film during cooling after deposition and results in stronger adhesion.

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Abstract
1. 서론
2. 실험방법
3. 실험결과
4. 고찰
5. 결론
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UCI(KEPA) : I410-ECN-0101-2014-580-002569135