메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
Thi-Bich Mac (Hanoi University of Science and Technology) Tien-Long Banh (Hanoi University of Science and Technology) Duc-Toan Nguyen (Hanoi University of Science and Technology)
저널정보
Korean Society for Precision Engineering Journal of the Korean Society for Precision Engineering Journal of the Korean Society for Precision Engineering Vol.36 No.9
발행연도
2019.9
수록면
803 - 811 (9page)
DOI
10.7736/KSPE.2019.36.9.803

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
In this work, we present an experimental study on cutting force and chip shrinkage coefficient during the milling of SKD11 steel at elevated temperatures using a high-frequency induction heating method. To improve the determination of the chip shrinkage coefficient, a 3D scanning method incorporating GOM Inspect 3D data analysis software was used to measure the chip length. To evaluate the effect of the heating process on output data such as chip geometry, cutting force, and chip shrinkage coefficient, cutting experiments were conducted at room and elevated temperatures with the same machining parameters of cutting speed, feed rate, and cutting depth. The Taguchi orthogonal array method was subsequently used for experimental design to obtain optimum values of the machining parameters. The analysis of variance method was also performed to indicate the percentage effect of the machining parameters on the cutting force and chip shrinkage coefficient. Finally, models of the cutting force and chip shrinkage coefficient during thermal-assisted milling of SKD11 were established and compared with experimental data.

목차

1. Introduction
2. Experimental Procedures
3. Results and Discussions
4. Conclusions
REFERENCES

참고문헌 (14)

참고문헌 신청

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!

이 논문의 저자 정보

이 논문과 함께 이용한 논문

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2019-555-000968191