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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2011.1
- 수록면
- 41 - 47 (7page)
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초록· 키워드
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Currently, there is widespread adoption of silicon-based technologies for the implementation of radio frequency (RF) integrated passive devices (IPDs) because of their low-cost, small footprint and high performance. Also,the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. The UWB BPF makes use of lumped IPD technology on a silicon substrate CSMP (Chip Scale Module Package). In this paper, this filter shows 2.0 dB insertion loss and 15 dB return loss from 7.0 GHz to 9.0 GHz. To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size (1.4 mm×1.2 mm×0.40 mm) while achieving equivalent electrical performance.
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참고문헌 (7)
참고문헌 신청
C. Tang / 2002 / A Semi-lumped Balun Fabricated by Low Temperature Co-fired Ceramic / IEEE MTT-S Int. Microwave Symp. Dig : 2201 ~
C. W. Tang / 2002 / LTCC-MLC Chip-type Balun Realized by LC Resonance Method / Electron. Lett 38 (11) : 519 ~
J. N. Burghartz / 1996 / Microwave Inductors and Capacitors in Standard Multilevel Interconnect Silicon Technology / IEEE Trans. Microwave Theory Tech 44 (1)
K. Liu / 2006 / Full-Circuit Design Optimization of a RF Silicon Integrated Passive Device / Proc. 2006 IEEE Electrial Performance of Electrical Packaging
K. Liu / 2007 / Small Form-factor Integrated Passive Devices for SiP Applications / Proc. IEEE MTT-S International Microwave Symposium
C. W. Tang / 2002 / LTCC-MLC Chip-type Balun Realized by LC Resonance Method / Electron. Lett 38 (11) : 519 ~
J. N. Burghartz / 1996 / Microwave Inductors and Capacitors in Standard Multilevel Interconnect Silicon Technology / IEEE Trans. Microwave Theory Tech 44 (1)
K. Liu / 2006 / Full-Circuit Design Optimization of a RF Silicon Integrated Passive Device / Proc. 2006 IEEE Electrial Performance of Electrical Packaging
K. Liu / 2007 / Small Form-factor Integrated Passive Devices for SiP Applications / Proc. IEEE MTT-S International Microwave Symposium
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