지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
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In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.
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참고문헌 (10)
참고문헌 신청
K. Gilleo / 2003 / Area Array Packaging Process Professional / McGraw-Hill :172~173
F. Liu / 2009 / Microelectron. Reliab 49(1):79
K. Gilleo / 2003 / Area Array Packaging Process Professional / McGraw-Hill :20
D. T. Hsu / 2000 / Microelectronics J 31(4):271
Private Communication / 2011 / Hi-Tech Korea Co. Ltd :4~5
F. Liu / 2009 / Microelectron. Reliab 49(1):79
K. Gilleo / 2003 / Area Array Packaging Process Professional / McGraw-Hill :20
D. T. Hsu / 2000 / Microelectronics J 31(4):271
Private Communication / 2011 / Hi-Tech Korea Co. Ltd :4~5
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