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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2017.1
- 수록면
- 93 - 98 (6page)
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이 논문의 연구 히스토리 (3)
2017
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2-Ethylhexyl acrylate, butyl acrylate, methyl methacrylate, and 2-hydroxyethyl methacrylate were polymerized to synthesize acrylic pressure sensitive adhesive (PSA). Alumina and graphite as a filler were added to acrylic PSA to give thermal conductivity. In case of addition of both graphite and alumina, the thermal conductivity of PSA was increased compared with alumina alone due to enhancement of contact between two fillers followed by increasing thermal path in PSA matrix.
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참고문헌 (19)
참고문헌 신청
R.J. McGlen / 2004 / Integrated thermal management techniques for high power electronic devices / Applied Thermal Engineering 24:1143
Y. Xu / 2001 / Thermally conducting aluminum nitride polymer-matrix composites / Composites Part A: Applied Science and Manufacturing 32:1749
F.T. Tan / 2006 / Effects of coupling agents on the properties of epoxy-based electrically conductive adhesive / Int. Journal of Adhesion and Adhesives 26:406
Y. X. Fu / 2014 / Thermal conductivity enhancement with different fillers for epoxy resin adhesives / Applied Thermal Engineering 66:493
J. Y. Choi / 2014 / Improved thermal conductivity of graphene encapsulated poly(methyl methacrylate) nanocomposite adhesives with low loading amount of graphene / Composites Science and Technology 94:147
Y. Xu / 2001 / Thermally conducting aluminum nitride polymer-matrix composites / Composites Part A: Applied Science and Manufacturing 32:1749
F.T. Tan / 2006 / Effects of coupling agents on the properties of epoxy-based electrically conductive adhesive / Int. Journal of Adhesion and Adhesives 26:406
Y. X. Fu / 2014 / Thermal conductivity enhancement with different fillers for epoxy resin adhesives / Applied Thermal Engineering 66:493
J. Y. Choi / 2014 / Improved thermal conductivity of graphene encapsulated poly(methyl methacrylate) nanocomposite adhesives with low loading amount of graphene / Composites Science and Technology 94:147
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