A Complex Reinforced Polymer Interposer with Ordered Ni Grid and SiC Nano-whiskers Polyimide Composite Based on Micromachining Technology

Yanmei Liu; Yunna Sun; Yan Wang; Guifu Ding; Bin Sun; Xiaolin Zhao

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자료유형: 학술저널

저자정보: Yanmei Liu (Shanghai Jiao Tong University) Yunna Sun (Shanghai Jiao Tong University) Yan Wang (Shanghai Jiao Tong University) Guifu Ding (Shanghai Jiao Tong University) Bin Sun (Shanghai Jiao Tong University) Xiaolin Zhao (Shanghai Jiao Tong University)

저널정보: 대한금속·재료학회 Electronic Materials Letters Electronic Materials Letters Vol.13 No.1

발행연도: 2017.1

수록면: 29 - 36 (8page)

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A complex reinforced polymer interposer comprised with conductive Nicylinders, ordered Ni grid and SiC nano-whiskers/Polyimide (PI)composite was proposed. The conductive Ni cylinders distributing in themiddle of each Ni grid unite designed as the supporting structure wereused as electric connecting component for the interposer and wereinsulated by the SiC nano-whiskers/PI composite. The comprehensiveproperties of the complex reinforced polymer interposer were improvedby a complex reinforced mechanism: the improved thermal conductivityand mechanical strength by the Ni supporting structure and the reducedmetal/polymer interfacial mismatch due to the SiC nano-whiskers/PIcomposite with the optimized mixture ratio. The above complexreinforced polymer interposer and a traditional reinforced polymerinterposer only with Ni grid were fabricated using micro-machiningtechnology for comparative analysis. The comprehensive properties ofthese two polymer interposers were analyzed respectively. Comparedwith the traditional design, the comprehensive properties of the proposedcomplex reinforced polymer interposer were improved further, such as,21.3% increase for the Young modulus, 10.1% decrease for thecoefficient of thermal expansion (CTE) and 54.9% increase for thethermal conductivity. Such complex reinforced mechanism based on themetal ordered grid and random nano-whiskers has potential to expandthe applications of the polymer interposer.

참고문헌 (16)

참고문헌 신청

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