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학술대회자료
저자정보
문성기 (현대모비스) 김범렬 (현대모비스) 강구삼 (현대모비스) 나기범 (현대모비스) 한민형 (현대모비스) 김민우 (인팩)
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한국자동차공학회 한국자동차공학회 추계학술대회 및 전시회 2024년 한국자동차공학회 추계학술대회 및 전시회
발행연도
2024.11
수록면
1,493 - 1,497 (5page)

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초록· 키워드

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Nowadays, the characteristic of PCB composed in power conversion systems for electrified vehicles is that they are more integrated than before, and the number of species is subdivided and stacked. This is to secure the desired performance within the limited package size by reflecting the various needs of customers, and it has the advantage of increasing the degree of freedom in the internal structural layout design of the system and reducing the overall system size. Another feature of the PCB stacked assembly structure is that various mechanical items (press busbars, high-voltage/high-current/signal connectors, etc.) are inevitably used for electrical/structural connections between the stacked PCB. PCB generally go through the auto/manual soldering process followed by the coating and bonding process, which is to prevent the removal of the SMD circuit elements mounted through the coating to some extent, to prevent the quality problem of whiskers, and to fix the relatively heavy materials on the PCB surface through bonding to withstand the vibration and shock of the vehicle. At this time, the PCB coating process, which is easy to think about and overlook, can lead to major quality problems. It is a problem of poor connector contact due to scattering and splashing when applying PCB coating application. This problem is a structural
feature of PCB in which a large number of connectors are mounted by the aforementioned PCB additive assembly structure, and it is becoming more and more frequent and important. In particular, it is difficult to detect the initial defect unless the inside of the connector is deliberately inspected after the occurrence, and it is usually detected as a performance abnormality caused by poor connector contact in the performance inspection (EOL) after system complete assembly, so it is important to be aware that this problem may occur and prevent it in advance. In this paper, we will examine the problem of poor connector contact due to scattering and splashing when applying PCB coating solution, which is a serious quality problem that can occur in the PCB coating process, and trace and examine the mechanism of occurrence of this problem, and present guidelines to prevent the same problem from recurring.

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Abstract
1. 서론
2. 코팅액에 의한 커넥터 접촉 불량 문제
3. 코팅액에 의한 커넥터 접촉 불량 문제 원인 분석
4. 결론
References

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