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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2014.6
- 수록면
- 237 - 242 (6page)
이용수
초록· 키워드
오류제보하기
Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result.
The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.
The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.
목차
ABSTRACT
1. 서론
2. 낙하충격해석
3. 낙하충격수명해석
4. 솔더볼 접합부의 낙하수명 해석결과
5. 결론
References
참고문헌 (13)
참고문헌 신청
1. [학술지(정기간행물)] - 김성걸 / 2012 / 언더필을 고려한 Sn-1.0Ag-0.5Cu 조성의 솔더볼을 갖는 플립칩에서의 보드레벨 낙하 및 진동해석 / 한국생산제조시스템학회지 21 (2) : 225 ~ 231
2. [학술지(정기간행물)] - Kim, S. K. / 2009 / Dynamic Analysis of Flip Chips with Solder balls with two different compositions / Korea Society for Precision Engineering : 1 ~ 2
3. [학술대회논문] - Hung, T. Y. / 2008 / Validation and reliability assessment of board level drop test of chip scalepackaging / International Conference on Experimental Mechanics 7375 : 4 ~
4. [학술지(정기간행물)] - Arruda, L. / 2007 / Effect of Surrounding Air on Board Level Drop Tests of Flexible Printed Circuit Boards / IEEE : 1 ~ 4
5. [보고서] - Liu, Y. / 2007 / Board Level Drop Test Simulation for an Advanced MLP : 1 ~ 4
2. [학술지(정기간행물)] - Kim, S. K. / 2009 / Dynamic Analysis of Flip Chips with Solder balls with two different compositions / Korea Society for Precision Engineering : 1 ~ 2
3. [학술대회논문] - Hung, T. Y. / 2008 / Validation and reliability assessment of board level drop test of chip scalepackaging / International Conference on Experimental Mechanics 7375 : 4 ~
4. [학술지(정기간행물)] - Arruda, L. / 2007 / Effect of Surrounding Air on Board Level Drop Tests of Flexible Printed Circuit Boards / IEEE : 1 ~ 4
5. [보고서] - Liu, Y. / 2007 / Board Level Drop Test Simulation for an Advanced MLP : 1 ~ 4
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