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논문 기본 정보

자료유형
학술저널
저자정보
장총민 (Seoul National University of Science and Technology) 김성걸 (Seoul National University of Science and Technology)
저널정보
한국생산제조학회 한국생산제조학회지 한국생산제조시스템학회지 Vol.23 No.3
발행연도
2014.6
수록면
237 - 242 (6page)

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초록· 키워드

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Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result.
The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

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ABSTRACT
1. 서론
2. 낙하충격해석
3. 낙하충격수명해석
4. 솔더볼 접합부의 낙하수명 해석결과
5. 결론
References

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UCI(KEPA) : I410-ECN-0101-2015-550-001698335