Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste

엄용성; 손지혜; 이학선; 최광성; 배현철; 최정열; 오태성; 문종태

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자료유형: 학술저널

저자정보: 엄용성 손지혜 이학선 최광성 배현철 최정열 오태성 문종태

저널정보: 한국마이크로전자및패키징학회 마이크로전자 및 패키징학회지 마이크로전자 및 패키징학회지 제22권 제1호

발행연도: 2015.1

수록면: 51 - 54 (4page)

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An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed ofresin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to performa conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principleof the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performedusing screen-printing technology. The optimum electro-plating condition was experimentally determined byprocessing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplatingin the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion,the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a currentdensity of 40mA/cm2 and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More detailsof the mechanical properties and processing conditions will be investigated in further research.

#electro-plating Cu #hybrid Cu paste #isotropic conductive adhesive

참고문헌 (10)

참고문헌 신청

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A. Nguyen / 2009 / Feasibility of Improving Front Metallization Lines for Photovoltaic Devices / Proc. 34th Photovoltaic Specialists Conference (PVSC) : 000312 ~

J. W. Baek / 2010 / Chemo-rheological Characteristic of a Selfassembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder / Microelectron. Eng 87

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