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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2009.1
- 수록면
- 1 - 9 (9page)
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Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.
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참고문헌 (21)
참고문헌 신청
Bo-In Noh / 2009 / Reliability of Au bump flip chip packages with adhesive materials using four-point bending test / International Journal of Adhesion and Adhesives 29 : 650
De-Shin Liu / 2008 / Failure mode analysis of lead-free solder joints under high speed impact testing / Materials Science and Engineering A 494 : 196 ~
Hsien-Chie Cheng / 2009 / On the Thermal-Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film Technology / IEEE Transactions on Advanced Packaging 32 :
Hyoung-Joon Kim / 2008 / Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish / Journal
J. H. Constable / 2006 / Analysis of the Constriction Resistance in an ACF Bond / IEEE Transactions on Components and Packaging Technologies 29 : 494 ~
De-Shin Liu / 2008 / Failure mode analysis of lead-free solder joints under high speed impact testing / Materials Science and Engineering A 494 : 196 ~
Hsien-Chie Cheng / 2009 / On the Thermal-Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film Technology / IEEE Transactions on Advanced Packaging 32 :
Hyoung-Joon Kim / 2008 / Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish / Journal
J. H. Constable / 2006 / Analysis of the Constriction Resistance in an ACF Bond / IEEE Transactions on Components and Packaging Technologies 29 : 494 ~
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